US Patent Issued to FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY on July 14 for "Method of fabricating a semiconductor package using an insulating polymer layer" (South Korean Inventors)

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Period15 Jul 2020

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  • TitleUS Patent Issued to FOUNDATION FOR RESEARCH AND BUSINESS, SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY on July 14 for "Method of fabricating a semiconductor package using an insulating polymer layer" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date15/07/20
    PersonsDong woon Kim
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