US Patent Issued to SAMSUNG ELECTRONICS on Nov. 1 for "Integrated circuit device and method of manufacturing the same" (South Korean Inventors)

Press/Media

Period	2 Nov 2022

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRONICS on Nov. 1 for "Integrated circuit device and method of manufacturing the same" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	2/11/22
URL	metabase.moreover.com/noarticleurl?type=psh&lni=66S2-NFD1-JDKC-R17J-00000-00
Persons	Jeong hoan Park