US Patent Issued to SAMSUNG ELECTRONICS, SAMSUNG SDI on Dec. 27 for "Poly(amide-imide) copolymer, composition for preparing same, article including same, and display device including the article" (South Korean Inventors)

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• Title	US Patent Issued to SAMSUNG ELECTRONICS, SAMSUNG SDI on Dec. 27 for "Poly(amide-imide) copolymer, composition for preparing same, article including same, and display device including the article" (South Korean Inventors)
  Media name/outlet	US Fed News
  Country/Territory	United States
  Date	28/12/22
  Persons	Sunghun Jin