US Patent Issued to Seoul National University of Technology Center for Industry Collaboration on June 7 for "Method for measuring adhesive strength of thin film using dispersion characteristics of surface waves, and computer-readable recording medium havi

Media coverage

• Title	US Patent Issued to Seoul National University of Technology Center for Industry Collaboration on June 7 for "Method for measuring adhesive strength of thin film using dispersion characteristics of surface waves, and computer-readable recording medium havi
  Media name/outlet	US Fed News
  Country/Territory	United States
  Date	7/06/22
  Persons	sung ook park