Engineering
Thin Films
63%
Nanofluid
56%
Transients
47%
Thermal Conductivity
46%
Microchannel
30%
Metal Organic Chemical Vapor Deposition
27%
Conductivity Measurement
22%
Thermal Load
22%
Friction Factor
20%
Nanoparticle
20%
Design Factor
19%
Aspect Ratio
19%
Cooling Load
18%
Silicon Dioxide
18%
Reynolds' Number
17%
Schottky Barrier
17%
Liquid Flow
15%
Charge Density
14%
Iso
14%
Hydrogen Damage
14%
Lattice Parameter
14%
Lattice Constant
14%
Building Envelope
14%
Envelope Design
14%
Particular Matter 2.5
12%
Phase Composition
12%
Random Access Memory
12%
Relative Humidity
12%
Microtube
11%
Current Measurement
10%
Oxide Layer
10%
Ferroelectric Random Access Memory Device
10%
Hydraulic Diameter
10%
Effective Thermal Conductivity
10%
Air Quality
10%
Roughness Effect
10%
Dielectrics
10%
Prandtl Number
10%
Deposition Temperature
9%
Photoresist
9%
Interface Trap
9%
Natural Convection
9%
Crystallinity
9%
Simulation Model
9%
Pressure Difference
9%
Eckert Number
9%
Side Wall
8%
Relative Weight
8%
Size Effect
8%
Monitoring System
8%
Material Science
Capacitor
100%
Ferroelectric Material
76%
Film
63%
Density
60%
Thin Films
38%
Thermal Conductivity
35%
Ferroelectric Thin Films
25%
Metal-Organic Chemical Vapor Deposition
25%
Oxide Compound
22%
Nanoparticle
21%
Ferroelectricity
20%
Annealing
20%
Phase Composition
18%
Film Thickness
17%
Schottky Barrier
13%
Lattice Constant
10%
Thin Film Structure
10%
Volume Fraction
10%
Chemical Vapor Deposition
9%
Crystal Structure
9%
Ferroelectric Film
8%
Field Effect Transistor
7%
Nitride Compound
7%
Nitriding
7%
Hydraulics
7%
Spin Coating
7%
Surface Property
7%
Thin Film Property
7%
Dielectric Material
6%
Carbon Nanotube
6%
Al2O3
6%
Titanium Dioxide
6%
Surface Roughness
6%
X-Ray Diffraction
5%
Thermal Stability
5%
