Abstract
Memristors are becoming increasingly recognized as candidates for neuromorphic devices due to their low power consumption, non-volatile memory, and synaptic properties and the ease of parallel computing through crossbar arrays. However, sneak current is a critical obstacle in crossbar arrays, and much research is being conducted to suppress the sneak current through self-rectifying characteristics. Here, we present a highly straightforward method for fabricating an active layer of a self-rectifying memristor through a single spin coating process, capitalizing on the attributes of spin coating, which initiates the reaction from the upper portion of the solution. We fabricated a self-rectifying memristor using an Ag/TiO2/TiOx/ITO structure through a vacuum-free solution process with low cost. During the spin-coating process, the reaction between titanium isopropoxide (TTIP) and ambient moisture formed TiO2 with an oxygen vacancy gradient. We confirmed the natural oxygen vacancy gradient using X-ray photoelectron spectroscopy (XPS) depth profiling and elucidated the resistance switching and self-rectifying mechanisms of the memristor based on the energy band structure. The memristors exhibited resistance switching and self-rectifying characteristics, which were essential characteristics for preventing sneak currents in a 3 × 3 crossbar array structure.
Original language | English |
---|---|
Pages (from-to) | 6881-6892 |
Number of pages | 12 |
Journal | Journal of Materials Chemistry C |
Volume | 12 |
Issue number | 19 |
DOIs | |
Publication status | Published - 16 Apr 2024 |
Bibliographical note
Publisher Copyright:© 2024 The Royal Society of Chemistry.