A novel solution-stamping process for preparation of a highly conductive aluminum thin film

Hye Moon Lee; Si Young Choi; Kyung Tae Kim; Jung Yeul Yun; Dae Soo Jung; Seung Bin Park; Jongwook Park

doi:10.1002/adma.201102805

A novel solution-stamping process for preparation of a highly conductive aluminum thin film

Hye Moon Lee
, Si Young Choi
, Kyung Tae Kim
, Jung Yeul Yun
, Dae Soo Jung
, Seung Bin Park
, Jongwook Park

Research output: Contribution to journal › Article › peer-review

63 Citations (Scopus)

Abstract

A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.

Original language	English
Pages (from-to)	5524-5528
Number of pages	5
Journal	Advanced Materials
Volume	23
Issue number	46
DOIs	https://doi.org/10.1002/adma.201102805
Publication status	Published - 8 Dec 2011

Keywords

aluminum ink
conductive features
electrodes
solution processes
thin films

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10.1002/adma.201102805

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abstract = "A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.",

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AU - Jung, Dae Soo

AU - Park, Seung Bin

AU - Park, Jongwook

PY - 2011/12/8

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AB - A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.

KW - aluminum ink

KW - conductive features

KW - electrodes

KW - solution processes

KW - thin films

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A novel solution-stamping process for preparation of a highly conductive aluminum thin film

Abstract

Keywords

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