A zero residual layer process for microimprint lithography using a soft mold

Byoung Kwon Choo; Jung Su Choi; Na Young Song; Ki Hwan Kim; Kyu Chang Park; Jin Jang

doi:10.1149/1.2898900

A zero residual layer process for microimprint lithography using a soft mold

Byoung Kwon Choo
, Jung Su Choi
, Na Young Song
, Ki Hwan Kim
, Kyu Chang Park
, Jin Jang

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

We studied the formation of a resist pattern by a zero residual layer process with microimprint lithography (MIL) using a soft mold. Polyethylene glycol-dimethacrylate as an UV hardening-type resist and polydimethylsiloxane as a soft mold were used for the MIL process. The stripe and square patterns with a zero residual layer process were achieved on Cr/glass. UV ozone was treated on the Cr to achieve a hydrophilic surface for a zero residual layer process, which was confirmed by the measurements of cross-sectional scanning electron microscopy and energy-dispersive X-ray microanalysis.

Original language	English
Pages (from-to)	J157-J160
Journal	Journal of the Electrochemical Society
Volume	155
Issue number	6
DOIs	https://doi.org/10.1149/1.2898900
Publication status	Published - 2008

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10.1149/1.2898900

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title = "A zero residual layer process for microimprint lithography using a soft mold",

abstract = "We studied the formation of a resist pattern by a zero residual layer process with microimprint lithography (MIL) using a soft mold. Polyethylene glycol-dimethacrylate as an UV hardening-type resist and polydimethylsiloxane as a soft mold were used for the MIL process. The stripe and square patterns with a zero residual layer process were achieved on Cr/glass. UV ozone was treated on the Cr to achieve a hydrophilic surface for a zero residual layer process, which was confirmed by the measurements of cross-sectional scanning electron microscopy and energy-dispersive X-ray microanalysis.",

author = "Choo, \{Byoung Kwon\} and Choi, \{Jung Su\} and Song, \{Na Young\} and Kim, \{Ki Hwan\} and Park, \{Kyu Chang\} and Jin Jang",

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doi = "10.1149/1.2898900",

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T1 - A zero residual layer process for microimprint lithography using a soft mold

AU - Choo, Byoung Kwon

AU - Choi, Jung Su

AU - Song, Na Young

AU - Kim, Ki Hwan

AU - Park, Kyu Chang

AU - Jang, Jin

PY - 2008

Y1 - 2008

N2 - We studied the formation of a resist pattern by a zero residual layer process with microimprint lithography (MIL) using a soft mold. Polyethylene glycol-dimethacrylate as an UV hardening-type resist and polydimethylsiloxane as a soft mold were used for the MIL process. The stripe and square patterns with a zero residual layer process were achieved on Cr/glass. UV ozone was treated on the Cr to achieve a hydrophilic surface for a zero residual layer process, which was confirmed by the measurements of cross-sectional scanning electron microscopy and energy-dispersive X-ray microanalysis.

AB - We studied the formation of a resist pattern by a zero residual layer process with microimprint lithography (MIL) using a soft mold. Polyethylene glycol-dimethacrylate as an UV hardening-type resist and polydimethylsiloxane as a soft mold were used for the MIL process. The stripe and square patterns with a zero residual layer process were achieved on Cr/glass. UV ozone was treated on the Cr to achieve a hydrophilic surface for a zero residual layer process, which was confirmed by the measurements of cross-sectional scanning electron microscopy and energy-dispersive X-ray microanalysis.

UR - https://www.scopus.com/pages/publications/43049093763

U2 - 10.1149/1.2898900

DO - 10.1149/1.2898900

M3 - Article

AN - SCOPUS:43049093763

SN - 0013-4651

VL - 155

SP - J157-J160

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

IS - 6

ER -

A zero residual layer process for microimprint lithography using a soft mold

Abstract

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