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AlGaN/InGaN HEMTs for RF current collapse suppression

  • W. Lanford
  • , V. Kumar
  • , R. Schwindt
  • , A. Kuliev
  • , I. Adesida
  • , A. M. Dabiran
  • , A. M. Wowchak
  • , P. P. Chow
  • , J. W. Lee

Research output: Contribution to journalArticlepeer-review

32 Citations (Scopus)

Abstract

A report is made on the DC, RF and large-signal pulsed characteristics of unpassivated AlGaN/InGaN/GaN high electron-mobility transistors (HEMTs) grown by molecular beam epitaxy on sapphire substrates. The devices with a 0.5 μm gate-length exhibited relatively flat transconductance (gm) with a maximum drain current of 880 mA/mm, a peak gm of 156 mS/mm, an f T of 17.3 GHz, and an fMAX of 28.7 GHz. In addition to promising DC and RF results, pulsed I-V measurements reveal that there is little current collapse in the AlGaN/InGaN HEMTs. These results indicate that the output power of InGaN channel HEMTs should not be limited by surface-state-related current collapse.

Original languageEnglish
Pages (from-to)771-772
Number of pages2
JournalElectronics Letters
Volume40
Issue number12
DOIs
Publication statusPublished - 10 Jun 2004

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