Comparative analysis on negative-bias-illumination-stress instabilities between planar- and vertical-channel thin-film transistors using InGaZnO active channels prepared by atomic-layer deposition

Ji Won Kang, Dong Hee Lee, Young Ha Kwon, Nak Jin Seong, Kyu Jeong Choi, Chi Sun Hwang, Sung Min Yoon

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

It is of the utmost importance to highlight the necessity of characterizing the operational stabilities of vertical-channel thin-film transistors (VTFTs) using In-Ga-Zn-O (IGZO) channel layers as potential back-plane devices for larger-area and higher-resolution display applications. To elucidate the structural variations in channel structures, the device characteristics of the mesa-shaped VTFT were compared with those of the conventional planar-channel TFT (PTFT). The results demonstrated that there were no significant differences in positive-bias stability between the VTFT and the PTFT. Nevertheless, under negative-bias-illumination stress (NBIS), VTFTs and PTFTs exhibited quite distinct instability behavior. The results were suggested to be attributed to the photo-ionization of oxygen vacancy (VO) initiated under illumination stress below a given wavelength. To ascertain the discrepancies in operational behaviors between the two devices, the shift in turn-on voltage (ΔVON) and the change in subthreshold swing (ΔSS) were examined with a lapse of stress time. The ΔVON values were +0.11 V and +0.18 V for the PTFT and VTFT, respectively, under a stress of −2 MV/cm for 3600 s in a dark state. In contrast, under the same conditions with a blue wavelength, they were −0.45 V and −1.81 V, respectively. A larger negative ΔVON for the VTFT was suggested to result from a larger amount of intrinsic defects, such as VO, which originated from the rugged back-channel corresponding to the vertical sidewall of the spacer pattern. The defect-related carrier (DRC) generation may result in a higher degree of VO photo-ionization for the VTFT. As a result, the VTFT showed a positive ΔSS of +120 mV/dec, in contrast to the PTFT, which showed a ΔSS close to zero. This scenario was verified by evaluating the subgap density-of-states within the atomic-layer-deposited IGZO channels for both devices using the thermally-activated electron model. The findings provide valuable insights for the accurate evaluation of the NBIS instability of the IGZO VTFT.

Original languageEnglish
Article number108665
JournalMaterials Science in Semiconductor Processing
Volume181
DOIs
Publication statusPublished - Oct 2024

Bibliographical note

Publisher Copyright:
© 2024 Elsevier Ltd

Keywords

  • Atomic-layer deposition (ALD)
  • In-Ga-Zn-O (IGZO)
  • Oxide semiconductor
  • Thin-film-transistor (TFT)
  • Vertical channel

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