Abstract
We demonstrated a Cu gate hydrogenated amorphous silicon thin-film transistor (TFT) with buffer layers. We introduced an AlN/Cu/Al2O3 multilayer for a gate of an a-Si : H TFT. The Al2O3 improves the adhesion to glass substrate and AlN protect the Cu diffusion to the TFT and plasma damage to Cu during plasma enhanced chemical vapor deposition of silicon-nitride. An a-Si : H TFT with a Cu gate exhibited a field effect mobility of 1.18 cm2/Vs, a gate voltage swing of 0.87 V/dec., and a threshold voltage of 3.5 V.
| Original language | English |
|---|---|
| Pages (from-to) | 324-326 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 23 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - Jun 2002 |
Keywords
- AMLCD
- Low resistivity
- Metal
- Thin-film transistor (TFT)