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Creation of interface states between SiO2 and a-Si:H in a-Si:H thin film transistors by bias-stress

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Abstract

The bias-stress effects on hydrogenated amorphous silicon (a-Si:H) thin film transistors (TFTs) with a single-layered SiO2 gate insulator were studied. The state density in the gap of a-Si:H for the a-Si:H TFT with N2 plasma treated SiO2 gate insulator is not changed by positive or negative bias-stress. On the other hand, the density of states in the gap of a-Si:H for the a-Si:H TFT with H2 plasma treated SiO2 gate insulator is greatly increased by positive or negative bias-stress. These experimental results demonstrate that the bulk density of a-Si:H is not changed even after long time bias-stress for the a-Si:H TFTs. The bias induced changes in a-Si:H TFTs are due to the changes in the interface state density between a-Si:H and a gate insulator.

Original languageEnglish
Pages (from-to)428-431
Number of pages4
JournalJournal of Non-Crystalline Solids
Volume198-200
Issue numberPART 1
DOIs
Publication statusPublished - May 1996

Bibliographical note

Funding Information:
This work was supported by the Korea Science and Engineering Foundation through the Semiconductor Physics Research Center.

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