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Design and verification of a high-speed connector for multi-media system

  • Huijin Song
  • , Jonghoon J. Kim
  • , Junyong Park
  • , Joungho Kim
  • , Junho Lee
  • , Seongmin Choi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Citations (Scopus)

Abstract

Recently, the number of high-definition media devices such as 8K ultra high-definition (UHD) TV and virtual reality (VR) is rapidly increasing. These multimedia systems require higher data rates for high resolution and versatility. With this increasing technical trend, high-speed connectors and cables are also becoming important. In this paper, we propose a highspeed connector that can transmit high-speed media data. The previous connectors have focused only on a physical connection and a mechanical reliability. However, as the data rate is increased, electrical performances of the connector have also become highly important. Therefore, signal integrity (SI) analysis for insertion loss, attenuation-to-crosstalk ratio (ACR), and impedance mismatch become essential for the high-speed connector. For verification, the 3D EM simulation tool is used to compare the performance of the previous and proposed connector. In conclusion, the proposed high-speed connector has better electrical performances than that of the previous connector.

Original languageEnglish
Title of host publication2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages22-25
Number of pages4
ISBN (Electronic)9781538622308
DOIs
Publication statusPublished - 20 Oct 2017
Event2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Washington, United States
Duration: 7 Aug 201711 Aug 2017

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Conference

Conference2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017
Country/TerritoryUnited States
CityWashington
Period7/08/1711/08/17

Bibliographical note

Publisher Copyright:
© 2017 IEEE.

Keywords

  • high-speed connector
  • multi-media system
  • signal integrity(SI)

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