Skip to main navigation Skip to search Skip to main content

Effect of rapid thermal annealing on GaN damages induced by electron cyclotron resonance reactive ion etching

  • Jae Hyung Yi
  • , Chinkyo Kim
  • , Min Hong Kim
  • , Min Yang
  • , Jina Jeon
  • , Sungwon Khym
  • , Meounghwan Cho
  • , Seogwoo Lee
  • , Yoonho Choi
  • , Shi Jong Leem

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

The effects of ECR-RIE (Electron Cyclotron Resonance Reactive Ion Etching) with chemistries of BCl3, Cl2, Ar and a subsequent thermal annealing on the electrical and optical properties of the GaN layer were investigated by employing transmission line measurements, atomic force microscopy, X-ray photoelectron spectroscopy, photoluminesconce. It was found that electrical properties were greatly affected by etching conditions, and these alterations of the properties were mainly due to a physical damage. And the dry etching caused a degradation of the optical properties of GaN, and a thermal treatment could be used to anneal out the damage partially.

Original languageEnglish
Pages (from-to)S364-S367
JournalJournal of the Korean Physical Society
Volume39
Issue numberSUPPL. Part 1
Publication statusPublished - Dec 2001

Fingerprint

Dive into the research topics of 'Effect of rapid thermal annealing on GaN damages induced by electron cyclotron resonance reactive ion etching'. Together they form a unique fingerprint.

Cite this