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Effects of Oxidants on the Bias-Stress Instabilities of In-Ga-Zn-O Thin Film Transistors Using HfO2 Gate Insulator Prepared by Atomic Layer Deposition

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28 Citations (Scopus)

Abstract

We fabricated the In-Ga-Zn-O thin-film transistors using HfO2 gate insulator prepared by atomic-layer deposition with different oxidants of H2O and O3 at 200 °C. While the device using H2O showed almost no change in threshold voltage (Vth) even after 104 s with bias-stresses, the device using O3 showed the Vth shifts of-1.4 and +1.2 V under positive and negative bias stresses, respectively. Defect-related carrier generation model was suggested as a physical origin for the anomalous bias-stress instabilities and the related mechanisms, in which the incorporated hydrogens can interact with oxygen-related defects.

Original languageEnglish
Article number8977494
Pages (from-to)425-428
Number of pages4
JournalIEEE Electron Device Letters
Volume41
Issue number3
DOIs
Publication statusPublished - Mar 2020

Bibliographical note

Publisher Copyright:
© 1980-2012 IEEE.

Keywords

  • In-Ga-Zn-O (IGZO)
  • atomic-layer deposition (ALD)
  • device reliability
  • high-k HfO
  • thin-film transistor (TFT)

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