Abstract
We fabricated the In-Ga-Zn-O thin-film transistors using HfO2 gate insulator prepared by atomic-layer deposition with different oxidants of H2O and O3 at 200 °C. While the device using H2O showed almost no change in threshold voltage (Vth) even after 104 s with bias-stresses, the device using O3 showed the Vth shifts of-1.4 and +1.2 V under positive and negative bias stresses, respectively. Defect-related carrier generation model was suggested as a physical origin for the anomalous bias-stress instabilities and the related mechanisms, in which the incorporated hydrogens can interact with oxygen-related defects.
| Original language | English |
|---|---|
| Article number | 8977494 |
| Pages (from-to) | 425-428 |
| Number of pages | 4 |
| Journal | IEEE Electron Device Letters |
| Volume | 41 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - Mar 2020 |
Bibliographical note
Publisher Copyright:© 1980-2012 IEEE.
Keywords
- In-Ga-Zn-O (IGZO)
- atomic-layer deposition (ALD)
- device reliability
- high-k HfO
- thin-film transistor (TFT)
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