Abstract
150-nm channel length vertical synapse transistor with oxide channel was demonstrated. The implementation of mesa-Type vertical channels effectively minimized the device footprint, enhancing both the compactness and efficiency. The fabricated vertical synapse transistor exhibited a high on/off ratio of 6.3 × 1010 at a drain bias of 1 V and demonstrated a current drivability of 13.5 μA/μm. The superior on/off ratio ensures minimal leakage current, contributing to enhanced energy efficiency and serving as a strength in multi-levels implementations. In particular, the device has implemented the energy consumption at the fJ-level and 120 multi-levels, highlighting the strong potential of next-generation neuromorphic computing.
| Original language | English |
|---|---|
| Pages (from-to) | 1673-1676 |
| Number of pages | 4 |
| Journal | IEEE Electron Device Letters |
| Volume | 45 |
| Issue number | 9 |
| DOIs | |
| Publication status | Published - 2024 |
Bibliographical note
Publisher Copyright:© 1980-2012 IEEE.
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 7 Affordable and Clean Energy
Keywords
- atomic-layer deposition
- Neuromorphic computing
- vertical channel synapse transistor
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