Abstract
A flexible charge-trap-type memory (f-CTM) thin-film transistor was proposed and fabricated on poly(ethylene naphthalate) (PEN) substrate. All the fabrication process temperature was suppressed below 180 °C. To improve the surface roughness and water vapor transmission rate of the PEN substrate, the organic/inorganic hybrid barrier layer was introduced. The gate-stack was composed of all oxide layers, such as In-Ga-Zn-O active channel, ZnO charge-trap layer, Al2O3 blocking/tunneling layers, and In-Sn-O transparent electrode, in which double-layered tunneling and top-protection layers were designed, so that the f-CTMs could exhibit stable and excellent device performance. As results, wide memory margin (25.6 V), fast programming speed ( ∼ 500 ns), and long retention time (>3 h) were obtained at room temperature and at 80 °C. Furthermore, these memory device characteristics were not degraded even after the delamination of PEN substrate and under the bending situation with a given curvature radius (3.3 mm).
| Original language | English |
|---|---|
| Article number | 7422074 |
| Pages (from-to) | 1557-1564 |
| Number of pages | 8 |
| Journal | IEEE Transactions on Electron Devices |
| Volume | 63 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - Apr 2016 |
Bibliographical note
Publisher Copyright:© 2016 Ieee.
Keywords
- Charge-trap memory
- Thin-film transistor (TFT).
- flexible electronics
- flexible substrate
- oxide semiconductor
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