TY - JOUR
T1 - Improvement of Au Adhesion on Parylene-c and SiO2 Substrates Using Oxygen Plasma Treatment
AU - Lee, J. H.
AU - Hwang, K. S.
AU - Yoon, K. H.
AU - Kim, T. S.
AU - Ahn, S.
N1 - Copyright:
Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2003
Y1 - 2003
N2 - Parylene-c (Pa-c) film is a pinhole-free barrier against moisture, chemical and biofluid. So it is candidated for low dielectric materials for the application of biosensors such as DNA and protein chip. For electrical protein detection system, gold (Au) are being considered for the immobilization surface of antigen-antibody conjugation. But adhesion of Au on Pa-c and SiO2 is a major hurdle in the reliable and durable performance in the biosensors. Pa-c and SiO2 films are deposited on Si substrate using a vapor deposition method and LPCVD, respectively. Au was then deposited on both substrates using e-beam evaporation method. For improvement of Au adhesion on Pa-c and SiO2 surface, surface modification of Pa-c and SiO 2 was performed using oxygen plasma. Pa-c and SiO2 layers were exposed to oxygen plasma using RIE(reactive ion etcher) at various power and times. Tape-test analysis was used for qualitative adhesive comparison of Au on Pa-c and SiO2 substrates. Contact angle measurements were performed before and after oxygen plasma treatment. Surface roughness and microstructures were observed using FESEM and AFM at various RIE treatment conditions. From the results, the increase in adhesion for the Au on oxygen plasma treated Pa-c and SiO2 surfaces is attributed to increased surface energy and roughness.
AB - Parylene-c (Pa-c) film is a pinhole-free barrier against moisture, chemical and biofluid. So it is candidated for low dielectric materials for the application of biosensors such as DNA and protein chip. For electrical protein detection system, gold (Au) are being considered for the immobilization surface of antigen-antibody conjugation. But adhesion of Au on Pa-c and SiO2 is a major hurdle in the reliable and durable performance in the biosensors. Pa-c and SiO2 films are deposited on Si substrate using a vapor deposition method and LPCVD, respectively. Au was then deposited on both substrates using e-beam evaporation method. For improvement of Au adhesion on Pa-c and SiO2 surface, surface modification of Pa-c and SiO 2 was performed using oxygen plasma. Pa-c and SiO2 layers were exposed to oxygen plasma using RIE(reactive ion etcher) at various power and times. Tape-test analysis was used for qualitative adhesive comparison of Au on Pa-c and SiO2 substrates. Contact angle measurements were performed before and after oxygen plasma treatment. Surface roughness and microstructures were observed using FESEM and AFM at various RIE treatment conditions. From the results, the increase in adhesion for the Au on oxygen plasma treated Pa-c and SiO2 surfaces is attributed to increased surface energy and roughness.
UR - http://www.scopus.com/inward/record.url?scp=0141962587&partnerID=8YFLogxK
M3 - Conference article
AN - SCOPUS:0141962587
SN - 0730-9244
SP - 292
JO - IEEE International Conference on Plasma Science
JF - IEEE International Conference on Plasma Science
T2 - 2003 IEEE International Conference on Plasma Science
Y2 - 2 June 2003 through 5 June 2003
ER -