Improvement of Au Adhesion on Parylene-c and SiO₂ Substrates Using Oxygen Plasma Treatment

Material Science

• Film 100%
• Biosensor 100%
• Contact Angle 50%
• Surface Modification 50%
• Surface Energy 50%
• Low Pressure Chemical Vapor Deposition 50%
• Dielectric Material 50%

Engineering

• Plasma Treatment 100%
• Silicon Dioxide 100%
• Bioinstrumentation 40%
• Dielectrics 20%
• Contact Angle Measurement 20%
• Durables 20%
• Si Substrate 20%
• Sio2 Layer 20%
• Sio2 Film 20%
• Vapor Deposition Method 20%
• Test Analysis 20%
• Interfacial Energy 20%

Chemical Engineering

• Film 100%
• Vapor Deposition 50%
• Angle Measurement 50%
• Low Pressure Chemical Vapor Deposition 50%