TY - JOUR
T1 - Integrated, Transparent Silicon Carbide Electronics and Sensors for Radio Frequency Biomedical Therapy
AU - Nguyen, Tuan Khoa
AU - Yadav, Sharda
AU - Truong, Thanh An
AU - Han, Mengdi
AU - Barton, Matthew
AU - Leitch, Michael
AU - Guzman, Pablo
AU - Dinh, Toan
AU - Ashok, Aditya
AU - Vu, Hieu
AU - Dau, Van
AU - Haasmann, Daniel
AU - Chen, Lin
AU - Park, Yoonseok
AU - Do, Thanh Nho
AU - Yamauchi, Yusuke
AU - Rogers, John A.
AU - Nguyen, Nam Trung
AU - Phan, Hoang Phuong
N1 - Publisher Copyright:
© 2022 American Chemical Society.
PY - 2022/7/26
Y1 - 2022/7/26
N2 - The integration of micro- and nanoelectronics into or onto biomedical devices can facilitate advanced diagnostics and treatments of digestive disorders, cardiovascular diseases, and cancers. Recent developments in gastrointestinal endoscopy and balloon catheter technologies introduce promising paths for minimally invasive surgeries to treat these diseases. However, current therapeutic endoscopy systems fail to meet requirements in multifunctionality, biocompatibility, and safety, particularly when integrated with bioelectronic devices. Here, we report materials, device designs, and assembly schemes for transparent and stable cubic silicon carbide (3C-SiC)-based bioelectronic systems that facilitate tissue ablation, with the capability for integration onto the tips of endoscopes. The excellent optical transparency of SiC-on-glass (SoG) allows for direct observation of areas of interest, with superior electronic functionalities that enable multiple biological sensing and stimulation capabilities to assist in electrical-based ablation procedures. Experimental studies on phantom, vegetable, and animal tissues demonstrated relatively short treatment times and low electric field required for effective lesion removal using our SoG bioelectronic system. In vivo experiments on an animal model were conducted to explore the versatility of SoG electrodes for peripheral nerve stimulation, showing an exciting possibility for the therapy of neural disorders through electrical excitation. The multifunctional features of SoG integrated devices indicate their high potential for minimally invasive, cost-effective, and outcome-enhanced surgical tools, across a wide range of biomedical applications.
AB - The integration of micro- and nanoelectronics into or onto biomedical devices can facilitate advanced diagnostics and treatments of digestive disorders, cardiovascular diseases, and cancers. Recent developments in gastrointestinal endoscopy and balloon catheter technologies introduce promising paths for minimally invasive surgeries to treat these diseases. However, current therapeutic endoscopy systems fail to meet requirements in multifunctionality, biocompatibility, and safety, particularly when integrated with bioelectronic devices. Here, we report materials, device designs, and assembly schemes for transparent and stable cubic silicon carbide (3C-SiC)-based bioelectronic systems that facilitate tissue ablation, with the capability for integration onto the tips of endoscopes. The excellent optical transparency of SiC-on-glass (SoG) allows for direct observation of areas of interest, with superior electronic functionalities that enable multiple biological sensing and stimulation capabilities to assist in electrical-based ablation procedures. Experimental studies on phantom, vegetable, and animal tissues demonstrated relatively short treatment times and low electric field required for effective lesion removal using our SoG bioelectronic system. In vivo experiments on an animal model were conducted to explore the versatility of SoG electrodes for peripheral nerve stimulation, showing an exciting possibility for the therapy of neural disorders through electrical excitation. The multifunctional features of SoG integrated devices indicate their high potential for minimally invasive, cost-effective, and outcome-enhanced surgical tools, across a wide range of biomedical applications.
KW - Bio-Integrated Electronics
KW - Functional Endoscopy
KW - Irreversible Electroporation
KW - Radio Frequency Ablation
KW - Silicon Carbide
KW - Thermal Ablation
UR - http://www.scopus.com/inward/record.url?scp=85135221572&partnerID=8YFLogxK
U2 - 10.1021/acsnano.2c03188
DO - 10.1021/acsnano.2c03188
M3 - Article
C2 - 35816450
AN - SCOPUS:85135221572
SN - 1936-0851
VL - 16
SP - 10890
EP - 10903
JO - ACS Nano
JF - ACS Nano
IS - 7
ER -