Mechanical characteristics of the hard-polydimethylsiloxane for smart lithography

Ki Hwan Kim, Na Young Song, Byung Kwon Choo, Didier Pribat, Jin Jang, Kyu Chang Park

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Citations (Scopus)

Abstract

This paper is a study about mechanical characteristics of hard-polydimethylsiloxane (h-PDMS), we compared and analyzed physical properties of h-PDMS with polydimethylsiloxane (PDMS) which in non-photolithography patterning process. As a next generation (or advanced) patterning process, various methods of soft lithography for non-photolithography and low-cost is actively being researched, especially, PDMS uses are increasing with the material which the adhesiveness and formation is superior Recently, there is a report about a new process using h-PDMS that is improved the low Young’s modulus which is a mechanical weak point of PDMS will get good quality for nano-scale patterning. According to changing composition ratio of h-PDMS, we measured the crack density per unit length with radius of curvature, also measured the strain with a radius of curvature when starts creations of crack due to hardness of h-PDMS. With these experiments, we studied that it is possible to control mechanical characteristics of hard-PDMS with composition ratio, we showed possibility of improving at pattern collapse and twist which weak point of PDMS, and also showed that it is possible to fabricate desired hardness of h-PDMS.

Original languageEnglish
Title of host publicationEKC 2008 - Proceedings of the EU-Korea Conference on Science and Technology
EditorsSeung-Deog Yoo
PublisherSpringer Science and Business Media, LLC
Pages229-237
Number of pages9
ISBN (Print)9783540851899
DOIs
Publication statusPublished - 2008
Event1st EU-Korea Conference on Science and Technology, EKC 2008 - Heidelberg, Germany
Duration: 28 Aug 200831 Aug 2008

Publication series

NameSpringer Proceedings in Physics
Volume124
ISSN (Print)0930-8989
ISSN (Electronic)1867-4941

Conference

Conference1st EU-Korea Conference on Science and Technology, EKC 2008
Country/TerritoryGermany
CityHeidelberg
Period28/08/0831/08/08

Bibliographical note

Publisher Copyright:
© Springer-Verlag Berlin Heidelberg 2008.

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