Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test

Junyong Park; Hyesoo Kim; Jonghoon J. Kim; Hyosup Won; Bumhee Bae; Joungho Kim; Michael Bae; Dongho Ha

doi:10.1109/EPEPS.2015.7347141

Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test

Junyong Park
, Hyesoo Kim
, Jonghoon J. Kim
, Hyosup Won
, Bumhee Bae
, Joungho Kim
, Michael Bae
, Dongho Ha

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Citations (Scopus)

Abstract

In this paper, an RLGC model of a silicone rubber socket is proposed and compared with simulation results. Due to the reusability of the silicone rubber socket, it is suitable for a reliable test. In addition, its electrical performance is compared with that of conventional solder balls. The performance of the two are compared using measurements in both frequency and time domains. Their eye diagrams are nearly identical at the data rate of 28Gbps, which is the data rate of a single channel in a 100Gbps transceiver IC that consists of 4 parallel channels.

Original language	English
Title of host publication	2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	109-112
Number of pages	4
ISBN (Electronic)	9781479936410
DOIs	https://doi.org/10.1109/EPEPS.2015.7347141
Publication status	Published - 3 Dec 2015
Event	24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015 - San Jose, United States Duration: 25 Oct 2015 → 28 Oct 2015

Publication series

Name	2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015

Conference

Conference	24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015
Country/Territory	United States
City	San Jose
Period	25/10/15 → 28/10/15

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

Keywords

High speed channel
Modeling
Silicone rubber socket
Soldering
Test

Access to Document

10.1109/EPEPS.2015.7347141

Cite this

Park, J., Kim, H., Kim, J. J., Won, H., Bae, B., Kim, J., Bae, M., & Ha, D. (2015). Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test. In 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015 (pp. 109-112). Article 7347141 (2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEPS.2015.7347141

Park, Junyong ; Kim, Hyesoo ; Kim, Jonghoon J. et al. / Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test. 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 109-112 (2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015).

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title = "Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test",

abstract = "In this paper, an RLGC model of a silicone rubber socket is proposed and compared with simulation results. Due to the reusability of the silicone rubber socket, it is suitable for a reliable test. In addition, its electrical performance is compared with that of conventional solder balls. The performance of the two are compared using measurements in both frequency and time domains. Their eye diagrams are nearly identical at the data rate of 28Gbps, which is the data rate of a single channel in a 100Gbps transceiver IC that consists of 4 parallel channels.",

keywords = "High speed channel, Modeling, Silicone rubber socket, Soldering, Test",

author = "Junyong Park and Hyesoo Kim and Kim, \{Jonghoon J.\} and Hyosup Won and Bumhee Bae and Joungho Kim and Michael Bae and Dongho Ha",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015 ; Conference date: 25-10-2015 Through 28-10-2015",

year = "2015",

month = dec,

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doi = "10.1109/EPEPS.2015.7347141",

language = "English",

series = "2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015",

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Park, J, Kim, H, Kim, JJ, Won, H, Bae, B, Kim, J, Bae, M & Ha, D 2015, Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test. in 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015., 7347141, 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015, Institute of Electrical and Electronics Engineers Inc., pp. 109-112, 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015, San Jose, United States, 25/10/15. https://doi.org/10.1109/EPEPS.2015.7347141

Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test. / Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J. et al.
2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 109-112 7347141 (2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test

AU - Park, Junyong

AU - Kim, Hyesoo

AU - Kim, Jonghoon J.

AU - Won, Hyosup

AU - Bae, Bumhee

AU - Kim, Joungho

AU - Bae, Michael

AU - Ha, Dongho

PY - 2015/12/3

Y1 - 2015/12/3

N2 - In this paper, an RLGC model of a silicone rubber socket is proposed and compared with simulation results. Due to the reusability of the silicone rubber socket, it is suitable for a reliable test. In addition, its electrical performance is compared with that of conventional solder balls. The performance of the two are compared using measurements in both frequency and time domains. Their eye diagrams are nearly identical at the data rate of 28Gbps, which is the data rate of a single channel in a 100Gbps transceiver IC that consists of 4 parallel channels.

AB - In this paper, an RLGC model of a silicone rubber socket is proposed and compared with simulation results. Due to the reusability of the silicone rubber socket, it is suitable for a reliable test. In addition, its electrical performance is compared with that of conventional solder balls. The performance of the two are compared using measurements in both frequency and time domains. Their eye diagrams are nearly identical at the data rate of 28Gbps, which is the data rate of a single channel in a 100Gbps transceiver IC that consists of 4 parallel channels.

KW - High speed channel

KW - Modeling

KW - Silicone rubber socket

KW - Soldering

KW - Test

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DO - 10.1109/EPEPS.2015.7347141

M3 - Conference contribution

AN - SCOPUS:84962808882

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SP - 109

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BT - 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015

Y2 - 25 October 2015 through 28 October 2015

ER -

Park J, Kim H, Kim JJ, Won H, Bae B, Kim J et al. Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test. In 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 109-112. 7347141. (2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015). doi: 10.1109/EPEPS.2015.7347141

Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test

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Bibliographical note

Keywords

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