Abstract
In this letter, a new multi-level memory cell using lowerature polycrystalline silicon and oxide (LTPO) thin-film transistor (TFT) backplane is proposed. The multi-bit data storage can be achieved with a simple structure of two transistors and a capacitor, which controls the threshold voltage of a memory cell transistor exactly. In a memory cell, the lowerature polycrystalline silicon (LTPS) TFT provides excellent stability against bias stress or current stress. In addition, the oxide semiconductor TFT enables the long-term data storage by virtue of its extremely low off-state leakage current. The proposed memory is fabricated with the LTPO TFT process which includes p-type LTPS and n-type oxide TFTs. Furthermore, the implementation of the multi-level property is successfully verified by measured results.
| Original language | English |
|---|---|
| Article number | 9253554 |
| Pages (from-to) | 42-45 |
| Number of pages | 4 |
| Journal | IEEE Electron Device Letters |
| Volume | 42 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Jan 2021 |
Bibliographical note
Publisher Copyright:© 1980-2012 IEEE.
Keywords
- Thin-film transistor (TFT)
- lowerature polycrystalline silicon and oxide (LTPO)
- multi-level memory
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