Nanostructured copper micro-post wicks for advanced heat pipes

Y. S. Nam; S. Sharratt; Y. S. Ju

doi:10.1109/MEMSYS.2011.5734675

Nanostructured copper micro-post wicks for advanced heat pipes

Y. S. Nam, S. Sharratt, Y. S. Ju

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Citations (Scopus)

Abstract

Micro-heat pipes incorporating advanced wicks are promising for the thermal management of high power density semiconductor and MEMS devices. We report experimental characterization of the heat transfer performance of wicks consisting of dense arrays of superhydrophilic Cu micropost wicks fabricated using electrochemical deposition and controlled chemical oxidation. A very high heat removal capability (as high as 800 W/cm² with less than 35°C wick superheat) is demonstrated using 2×2 mm² thin-film heaters as heat sources. Superhydrophilic CuO nanostructures integrated onto the micropost surfaces are shown to enhance the critical heat flux by as much as 70 %.

Original language	English
Title of host publication	2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages	1313-1316
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2011.5734675
Publication status	Published - 2011
Event	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico Duration: 23 Jan 2011 → 27 Jan 2011

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Country/Territory	Mexico
City	Cancun
Period	23/01/11 → 27/01/11

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10.1109/MEMSYS.2011.5734675

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Nam, Y. S., Sharratt, S., & Ju, Y. S. (2011). Nanostructured copper micro-post wicks for advanced heat pipes. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011 (pp. 1313-1316). Article 5734675 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2011.5734675

@inproceedings{0a46b19dae684a75813ddfa1ceca242d,

title = "Nanostructured copper micro-post wicks for advanced heat pipes",

abstract = "Micro-heat pipes incorporating advanced wicks are promising for the thermal management of high power density semiconductor and MEMS devices. We report experimental characterization of the heat transfer performance of wicks consisting of dense arrays of superhydrophilic Cu micropost wicks fabricated using electrochemical deposition and controlled chemical oxidation. A very high heat removal capability (as high as 800 W/cm2 with less than 35°C wick superheat) is demonstrated using 2×2 mm2 thin-film heaters as heat sources. Superhydrophilic CuO nanostructures integrated onto the micropost surfaces are shown to enhance the critical heat flux by as much as 70 %.",

author = "Nam, {Y. S.} and S. Sharratt and Ju, {Y. S.}",

note = "Copyright: Copyright 2011 Elsevier B.V., All rights reserved.; 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 ; Conference date: 23-01-2011 Through 27-01-2011",

year = "2011",

doi = "10.1109/MEMSYS.2011.5734675",

language = "English",

isbn = "9781424496327",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "1313--1316",

booktitle = "2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011",

}

Nam, YS, Sharratt, S & Ju, YS 2011, Nanostructured copper micro-post wicks for advanced heat pipes. in 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011., 5734675, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 1313-1316, 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011, Cancun, Mexico, 23/01/11. https://doi.org/10.1109/MEMSYS.2011.5734675

Nanostructured copper micro-post wicks for advanced heat pipes. / Nam, Y. S.; Sharratt, S.; Ju, Y. S.
2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. 2011. p. 1313-1316 5734675 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Sharratt, S.

AU - Ju, Y. S.

PY - 2011

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N2 - Micro-heat pipes incorporating advanced wicks are promising for the thermal management of high power density semiconductor and MEMS devices. We report experimental characterization of the heat transfer performance of wicks consisting of dense arrays of superhydrophilic Cu micropost wicks fabricated using electrochemical deposition and controlled chemical oxidation. A very high heat removal capability (as high as 800 W/cm2 with less than 35°C wick superheat) is demonstrated using 2×2 mm2 thin-film heaters as heat sources. Superhydrophilic CuO nanostructures integrated onto the micropost surfaces are shown to enhance the critical heat flux by as much as 70 %.

AB - Micro-heat pipes incorporating advanced wicks are promising for the thermal management of high power density semiconductor and MEMS devices. We report experimental characterization of the heat transfer performance of wicks consisting of dense arrays of superhydrophilic Cu micropost wicks fabricated using electrochemical deposition and controlled chemical oxidation. A very high heat removal capability (as high as 800 W/cm2 with less than 35°C wick superheat) is demonstrated using 2×2 mm2 thin-film heaters as heat sources. Superhydrophilic CuO nanostructures integrated onto the micropost surfaces are shown to enhance the critical heat flux by as much as 70 %.

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DO - 10.1109/MEMSYS.2011.5734675

M3 - Conference contribution

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SN - 9781424496327

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 1313

EP - 1316

BT - 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011

T2 - 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011

Y2 - 23 January 2011 through 27 January 2011

ER -

Nanostructured copper micro-post wicks for advanced heat pipes

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