Skip to main navigation Skip to search Skip to main content

Preparation of PS-MWNT and PETE-MWNT Antistatic Materials via In Situ Polymerization for IC Tray Applications

  • Sangwook Park
  • , Taegeon Lee
  • , Sang Tae Kim
  • , Soonhang Lee
  • , Jihoon Lee
  • , Hayoon Lee
  • , Jongwook Park

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

To develop antistatic materials suitable for semiconductor wafer transportation trays, in situ polymerized polystyrene (PS) and polyester (PETE) materials incorporating multi-walled carbon nanotubes (MWNTs) were synthesized. Their thermal and electrical properties were evaluated under conditions relevant to semiconductor tray manufacturing. Both the PS and PETE materials exhibited improved thermal stability with an increasing MWNT content. Differential scanning calorimetry (DSC) revealed that the glass transition temperature (Tg) of the PS increased from 82 °C (0 wt%) to 86 °C (1.0 wt%) and 91 °C (2.0 wt%), while that of the PETE increased from 83 °C to 84 °C and 90 °C, respectively. Surface resistivity measurements also demonstrated enhanced electrical conductivity. For the PS, resistivity decreased from >1013 Ohm/sq to 8.8 × 103 and 3.7 × 103 Ohm/sq at 1.0 wt% and 2.0 wt% MWNT, respectively. The PETE materials followed a similar trend, with values dropping from >1013 Ohm/sq to 5.9 × 103 and 0.2 × 103 Ohm/sq. These results confirm that MWNT incorporation effectively enhances both thermal and electrical performance, demonstrating the potential of MWNT/PS and MWNT/PETE as antistatic materials for semiconductor applications.

Original languageEnglish
Article number5557
JournalApplied Sciences (Switzerland)
Volume15
Issue number10
DOIs
Publication statusPublished - May 2025

Bibliographical note

Publisher Copyright:
© 2025 by the authors.

Keywords

  • carbon nanotube
  • electrical conductivity
  • polyester
  • polymer
  • polystyrene

Fingerprint

Dive into the research topics of 'Preparation of PS-MWNT and PETE-MWNT Antistatic Materials via In Situ Polymerization for IC Tray Applications'. Together they form a unique fingerprint.

Cite this