RF-microwave multi-band design solutions for multilayer organic system on package integrated passives

M. F. Davis; S. W. Yoon; S. Mandal; N. Bushyager; M. Maeng; K. Lim; S. Pinel; A. Sutono; J. Laskar; M. Tentzeris; T. Nonaka; V. Sundaram; F. Liu; R. Tummala

doi:10.1109/MWSYM.2002.1012313

RF-microwave multi-band design solutions for multilayer organic system on package integrated passives

M. F. Davis, S. W. Yoon, S. Mandal, N. Bushyager, M. Maeng, K. Lim, S. Pinel, A. Sutono, J. Laskar, M. Tentzeris, T. Nonaka, V. Sundaram, F. Liu, R. Tummala

Research output: Contribution to journal › Article › peer-review

9 Citations (Scopus)

Abstract

We present multi-band design solutions for integrated passives using multilayer organic (MLO) process technology for RF and microwave System on Package(SOP) module development. The components developed in this technology include embedded high Q compact inductors and filters designed in three frequency bands: S, C and Ku applicable for Bluetooth, MMDS, IEEE802.11a WLAN and satellite communications. Measured inductor Q factor as high as 182 and Self-Resonant-Frequency(SRF) as high as 20GHz, which represents the highest Q in its frequency range reported to date in a multilayer technology, have been demonstrated. A time domain electromagnetic modeling technique is also use to characterize passive devices.

Original language	English
Pages (from-to)	2217-2220
Number of pages	4
Journal	IEEE MTT-S International Microwave Symposium Digest
Volume	3
DOIs	https://doi.org/10.1109/MWSYM.2002.1012313
Publication status	Published - 2002

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Davis, M. F., Yoon, S. W., Mandal, S., Bushyager, N., Maeng, M., Lim, K., Pinel, S., Sutono, A., Laskar, J., Tentzeris, M., Nonaka, T., Sundaram, V., Liu, F., & Tummala, R. (2002). RF-microwave multi-band design solutions for multilayer organic system on package integrated passives. IEEE MTT-S International Microwave Symposium Digest, 3, 2217-2220. https://doi.org/10.1109/MWSYM.2002.1012313

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title = "RF-microwave multi-band design solutions for multilayer organic system on package integrated passives",

abstract = "We present multi-band design solutions for integrated passives using multilayer organic (MLO) process technology for RF and microwave System on Package(SOP) module development. The components developed in this technology include embedded high Q compact inductors and filters designed in three frequency bands: S, C and Ku applicable for Bluetooth, MMDS, IEEE802.11a WLAN and satellite communications. Measured inductor Q factor as high as 182 and Self-Resonant-Frequency(SRF) as high as 20GHz, which represents the highest Q in its frequency range reported to date in a multilayer technology, have been demonstrated. A time domain electromagnetic modeling technique is also use to characterize passive devices.",

author = "Davis, {M. F.} and Yoon, {S. W.} and S. Mandal and N. Bushyager and M. Maeng and K. Lim and S. Pinel and A. Sutono and J. Laskar and M. Tentzeris and T. Nonaka and V. Sundaram and F. Liu and R. Tummala",

year = "2002",

doi = "10.1109/MWSYM.2002.1012313",

language = "English",

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Davis, MF, Yoon, SW, Mandal, S, Bushyager, N, Maeng, M, Lim, K, Pinel, S, Sutono, A, Laskar, J, Tentzeris, M, Nonaka, T, Sundaram, V, Liu, F & Tummala, R 2002, 'RF-microwave multi-band design solutions for multilayer organic system on package integrated passives', IEEE MTT-S International Microwave Symposium Digest, vol. 3, pp. 2217-2220. https://doi.org/10.1109/MWSYM.2002.1012313

TY - JOUR

T1 - RF-microwave multi-band design solutions for multilayer organic system on package integrated passives

AU - Davis, M. F.

AU - Yoon, S. W.

AU - Mandal, S.

AU - Bushyager, N.

AU - Maeng, M.

AU - Lim, K.

AU - Pinel, S.

AU - Sutono, A.

AU - Laskar, J.

AU - Tentzeris, M.

AU - Nonaka, T.

AU - Sundaram, V.

AU - Liu, F.

AU - Tummala, R.

PY - 2002

Y1 - 2002

N2 - We present multi-band design solutions for integrated passives using multilayer organic (MLO) process technology for RF and microwave System on Package(SOP) module development. The components developed in this technology include embedded high Q compact inductors and filters designed in three frequency bands: S, C and Ku applicable for Bluetooth, MMDS, IEEE802.11a WLAN and satellite communications. Measured inductor Q factor as high as 182 and Self-Resonant-Frequency(SRF) as high as 20GHz, which represents the highest Q in its frequency range reported to date in a multilayer technology, have been demonstrated. A time domain electromagnetic modeling technique is also use to characterize passive devices.

AB - We present multi-band design solutions for integrated passives using multilayer organic (MLO) process technology for RF and microwave System on Package(SOP) module development. The components developed in this technology include embedded high Q compact inductors and filters designed in three frequency bands: S, C and Ku applicable for Bluetooth, MMDS, IEEE802.11a WLAN and satellite communications. Measured inductor Q factor as high as 182 and Self-Resonant-Frequency(SRF) as high as 20GHz, which represents the highest Q in its frequency range reported to date in a multilayer technology, have been demonstrated. A time domain electromagnetic modeling technique is also use to characterize passive devices.

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U2 - 10.1109/MWSYM.2002.1012313

DO - 10.1109/MWSYM.2002.1012313

M3 - Article

AN - SCOPUS:0036066085

SN - 0149-645X

VL - 3

SP - 2217

EP - 2220

JO - IEEE MTT-S International Microwave Symposium Digest

JF - IEEE MTT-S International Microwave Symposium Digest

ER -

RF-microwave multi-band design solutions for multilayer organic system on package integrated passives

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