Role of oxygen vacancies in VFB/Vt stability of pFET metals on HfO2

E. Cartier, F. R. McFeely, V. Narayanan, P. Jamison, B. P. Linder, M. Copel, V. K. Paruchuri, V. S. Basker, R. Haight, D. Lim, R. Carruthers, T. Shaw, M. Steen, J. Sleight, J. Rubino, H. Deligianni, S. Guha, R. Jammy, G. Shahidi

Research output: Contribution to journalConference articlepeer-review

156 Citations (Scopus)

Abstract

We demonstrate experimentally that the flatband/threshold voltages (V fb/V,) of pFET metal gates are strongly dependent on the post-deposition annealing conditions of the gate stacks. By varying the temperature and the O2 partial pressure during post-deposition N 2/O2 and/or forming gas annealing (FGA) with Re, Ru and Pt, the gate stack Vfb, can change by as much as 750 mV. However, using Re as an example, it is shown that conditions can be optimized and V fb/Vt-tuning for pFETs can be achieved for aggressively scaled stacks. It is proposed that charge transfer from oxygen vacancies to the gate electrode, possible only for high workfunction metal gates, leads to the formation of a dipole layer near the gate which can shift Vfb. The results indicate that Vfb/Vt control remains a formidable processing challenge with high workfunction metals on HfO2.

Original languageEnglish
Article number1469279
Pages (from-to)230-231
Number of pages2
JournalDigest of Technical Papers - Symposium on VLSI Technology
Volume2005
DOIs
Publication statusPublished - 2005
Event2005 Symposium on VLSI Technology - Kyoto, Japan
Duration: 14 Jun 200514 Jun 2005

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