Abstract
The effect of thermal annealing on interfacial mixing of solution-processed organic light-emitting diodes (OLEDs) using direct sputter-depth profiling techniques is investigated. X-ray and ultraviolet photoelectron spectroscopy and argon gas cluster ion beam sputtering are used to investigate the distribution of chemical species near the interface. Extensive interfacial mixing is found in solution-processed OLEDs after the thermal annealing at temperatures below the glass transition temperature of the organic material, while such mixing is not evident in vapor-deposited devices. It is found that there is a partially mixed interface in the solution-processed devices prior to the annealing, which seems to promote effective interdiffusion during the annealing. Surprisingly, the extensive interfacial mixing after the thermal annealing appears to significantly enhance the efficiency of OLEDs.
| Original language | English |
|---|---|
| Article number | 1801627 |
| Journal | Advanced Materials Interfaces |
| Volume | 6 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 22 Feb 2019 |
Bibliographical note
Publisher Copyright:© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Keywords
- Ar gas cluster ion beam sputtering
- interfacial mixing
- organic light-emitting diodes
- thermal annealing
- time-of-flight mass spectroscopy