@inproceedings{200912a735c44e90a3fcf944e30559c2,
title = "Static Analysis of Sandwich Plates using ES-MITC3 Elements based on the Third-order Shear Deformation Layerwise Theory",
abstract = "In this paper, a 3-node triangular plate element is developed for static analysis of sandwich plates. The C0-plate element attenuates the shear-locking phenomenon by approximating the transverse shear strains according to the mixed interpolation of tensorial components technique (MITC3). The constant strain fields within each MITC3 plate element are improved by using the edge-based smoothed approach (ES), in which the strain fields are averaged on domains of two adjacent elements. Based on the layerwise theory with the displacement fields for each layer described by the third-order shear deformation theory (TSDT), the formulation of the ES-MITC3 plate element is derived for the static analysis of sandwich plates. The accuracy and efficiency of the proposed approach are verified through some benchmark sandwich plates subjected to sinusoidal or uniform distributed loads.",
keywords = "ES-MITC3 plate element, TSDT, layerwise theory, sandwich plates",
author = "Thanh Chau-Dinh and Loi Dang-Huu and Kim, {Jin Gyun}",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 5th International Conference on Green Technology and Sustainable Development, GTSD 2020 ; Conference date: 27-11-2020 Through 28-11-2020",
year = "2020",
month = nov,
day = "27",
doi = "10.1109/GTSD50082.2020.9303063",
language = "English",
series = "Proceedings of 2020 5th International Conference on Green Technology and Sustainable Development, GTSD 2020",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "59--65",
booktitle = "Proceedings of 2020 5th International Conference on Green Technology and Sustainable Development, GTSD 2020",
address = "United States",
}