TY - GEN
T1 - Study on the polycrystalline silicon films deposited by inductively coupled plasma chemical vapor deposition
AU - Moon, Byeong Y.
AU - Youn, Jae H.
AU - Won, Sung H.
AU - Jang, Jin
AU - Pietruszko, Stanislaw M.
N1 - Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2001
Y1 - 2001
N2 - Polycrystalline silicon thin films have been deposited by an inductively coupled plasma chemical vapor deposition using SiH4/H2 mixtures. The quality of poly-Si can be improved by increasing RF power and hydrogen dilution ratio. The poly-Si deposited at a RF power of 1000 W with an addition of H2, showed a Raman polycrystalline volume fraction of 85.7 %, FWHM of 6.4 cm-1, deposition rate of 9.64 Å/s and SEM grain size of ∼3000 Å.
AB - Polycrystalline silicon thin films have been deposited by an inductively coupled plasma chemical vapor deposition using SiH4/H2 mixtures. The quality of poly-Si can be improved by increasing RF power and hydrogen dilution ratio. The poly-Si deposited at a RF power of 1000 W with an addition of H2, showed a Raman polycrystalline volume fraction of 85.7 %, FWHM of 6.4 cm-1, deposition rate of 9.64 Å/s and SEM grain size of ∼3000 Å.
UR - http://www.scopus.com/inward/record.url?scp=34249870103&partnerID=8YFLogxK
U2 - 10.1557/proc-685-d5.2.1
DO - 10.1557/proc-685-d5.2.1
M3 - Conference contribution
AN - SCOPUS:34249870103
SN - 1558996214
SN - 9781558996212
T3 - Materials Research Society Symposium Proceedings
SP - 100
EP - 105
BT - Advanced Materials and Devices for Large-Area Electronics
PB - Materials Research Society
T2 - 2001 MRS Spring Meeting
Y2 - 16 April 2001 through 20 April 2001
ER -