Study on the polycrystalline silicon films deposited by inductively coupled plasma chemical vapor deposition

Byeong Y. Moon, Jae H. Youn, Sung H. Won, Jin Jang, Stanislaw M. Pietruszko

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

Polycrystalline silicon thin films have been deposited by an inductively coupled plasma chemical vapor deposition using SiH4/H2 mixtures. The quality of poly-Si can be improved by increasing RF power and hydrogen dilution ratio. The poly-Si deposited at a RF power of 1000 W with an addition of H2, showed a Raman polycrystalline volume fraction of 85.7 %, FWHM of 6.4 cm-1, deposition rate of 9.64 Å/s and SEM grain size of ∼3000 Å.

Original languageEnglish
Title of host publicationAdvanced Materials and Devices for Large-Area Electronics
PublisherMaterials Research Society
Pages100-105
Number of pages6
ISBN (Print)1558996214, 9781558996212
DOIs
Publication statusPublished - 2001
Event2001 MRS Spring Meeting - San Francisco, CA, United States
Duration: 16 Apr 200120 Apr 2001

Publication series

NameMaterials Research Society Symposium Proceedings
Volume685
ISSN (Print)0272-9172

Conference

Conference2001 MRS Spring Meeting
Country/TerritoryUnited States
CitySan Francisco, CA
Period16/04/0120/04/01

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