Systematic global calibration of a process simulator

Jun Ha Lee, Kwan Do Kim, Jeong Taek Kong, Seung Woo Lee, Young Wug Kim, Doo Heun Baek

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

This paper proposes a novel methodology of systematic global calibration of a process simulator and validates its accuracy and efficiency with application to memory and logic devices. With 175 SIMS profiles which cover the whole range of conditions of implant and diffusion processes in the fabrication lines, the dominant diffusion phenomenon in each process temperature region has been determined. Using the dual-Pearson implant model and the fully-coupled diffusion model, the calibration was performed systematically. We applied the globally calibrated process simulation parameters to memory and logic devices to predict the optimum process conditions for target device characteristics.

Original languageEnglish
Title of host publication2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
EditorsM. Laudon, B. Romanowicz
Pages52-55
Number of pages4
Publication statusPublished - 2000
Event2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000 - San Diego, CA, United States
Duration: 27 Mar 200029 Mar 2000

Publication series

Name2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000

Conference

Conference2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
Country/TerritoryUnited States
CitySan Diego, CA
Period27/03/0029/03/00

Keywords

  • Calibration
  • Diffusion
  • Implantation
  • Process Simulation
  • Silicidation

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