Abstract
The blue common layer (BCL) approach has become very useful methodology to reduce the process steps which may increase the production yield of active matrix organic light emitting diode (AMOLED) fabrication. From this approach, we can reduce one step (from 5 to 4) for fine metal masking (FMM) method as a current mass-production technology to form a common thick-microcavity structure. Moreover, we can reduce the patterning steps from 5 to 2 if we use a laser induced thermal imaging (LITI) technology for the same structure. Nevertheless, we still prefer to apply the FMM technology for the mass production because there are lots of problematic issues on LITI process such as an operating voltage increase (by 0.5-1.0 V), efficiency drop (by ∼10%), shorter lifetime, etc. Here, we report about the fundamental causes of these problems during LITI processes.
Original language | English |
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Pages (from-to) | 2945-2953 |
Number of pages | 9 |
Journal | Organic Electronics |
Volume | 13 |
Issue number | 12 |
DOIs | |
Publication status | Published - Dec 2012 |
Bibliographical note
Funding Information:This work was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (Grant No. NRF-2012-0001359 ). This research was also supported by Ministry of Knowledge Economy (Grant No. 10041062 ).
Keywords
- BCL
- Blue common layer
- Interface dipole moment
- LITI
- Laser induced thermal imaging