Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

Song Wan Cho; Kyul Han; Yeonjin Yi; Seong Jun Kang; Kyung Hwa Yoo; Kwangho Jeong; Chung Nam Whang

doi:10.1002/adem.200500188

Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

Song Wan Cho
, Kyul Han
, Yeonjin Yi
, Seong Jun Kang
, Kyung Hwa Yoo
, Kwangho Jeong
, Chung Nam Whang

Research output: Contribution to journal › Article › peer-review

32 Citations (Scopus)

Abstract

A package-level reliability test using a solder ball of a Sn-Ag-Cu-Ge alloy, was investigated. After using a lead-free solder in the manufacturing process, the discoloring problem arises after many times in the reflow process. The surface oxidation of the lead-free solders were investigated using X-ray photoelectron spectroscopy (XPS). The results show that Sn-Ag-Cu-Ge alloy is a good candidate to solve the oxidation problem and it is important to know the thermal oxidation mechanism and characteristics of the Pb-free solders.

Original language	English
Pages (from-to)	111-114
Number of pages	4
Journal	Advanced Engineering Materials
Volume	8
Issue number	1-2
DOIs	https://doi.org/10.1002/adem.200500188
Publication status	Published - Feb 2006

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10.1002/adem.200500188

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title = "Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge",

abstract = "A package-level reliability test using a solder ball of a Sn-Ag-Cu-Ge alloy, was investigated. After using a lead-free solder in the manufacturing process, the discoloring problem arises after many times in the reflow process. The surface oxidation of the lead-free solders were investigated using X-ray photoelectron spectroscopy (XPS). The results show that Sn-Ag-Cu-Ge alloy is a good candidate to solve the oxidation problem and it is important to know the thermal oxidation mechanism and characteristics of the Pb-free solders.",

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T1 - Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

AU - Cho, Song Wan

AU - Han, Kyul

AU - Yi, Yeonjin

AU - Kang, Seong Jun

AU - Yoo, Kyung Hwa

AU - Jeong, Kwangho

AU - Whang, Chung Nam

PY - 2006/2

Y1 - 2006/2

N2 - A package-level reliability test using a solder ball of a Sn-Ag-Cu-Ge alloy, was investigated. After using a lead-free solder in the manufacturing process, the discoloring problem arises after many times in the reflow process. The surface oxidation of the lead-free solders were investigated using X-ray photoelectron spectroscopy (XPS). The results show that Sn-Ag-Cu-Ge alloy is a good candidate to solve the oxidation problem and it is important to know the thermal oxidation mechanism and characteristics of the Pb-free solders.

AB - A package-level reliability test using a solder ball of a Sn-Ag-Cu-Ge alloy, was investigated. After using a lead-free solder in the manufacturing process, the discoloring problem arises after many times in the reflow process. The surface oxidation of the lead-free solders were investigated using X-ray photoelectron spectroscopy (XPS). The results show that Sn-Ag-Cu-Ge alloy is a good candidate to solve the oxidation problem and it is important to know the thermal oxidation mechanism and characteristics of the Pb-free solders.

UR - https://www.scopus.com/pages/publications/33644616275

U2 - 10.1002/adem.200500188

DO - 10.1002/adem.200500188

M3 - Article

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EP - 114

JO - Advanced Engineering Materials

JF - Advanced Engineering Materials

IS - 1-2

ER -

Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

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