Thermal stabilities and mechanical interfacial properties of polyethresulfone-modified epoxy resin

S. J. Park; K. Li; S. K. Hong

doi:10.4028/www.scientific.net/SSP.111.159

Thermal stabilities and mechanical interfacial properties of polyethresulfone-modified epoxy resin

S. J. Park
, K. Li
, S. K. Hong

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Citations (Scopus)

Abstract

The thermal stabilities and mechanical interfacial properties of a diglycidyl ether of bisphenol-A (DGEBA) epoxy resin modified with different contents of polyethersulfone (PES) have been investigated. As a result, the curing reaction rate of DGEBA/PES blends was decreased with increasing the PES content. The blends exhibited slight decrease of thermal stabilities compared to the neat DGEBA. The mechanical interfacial properties, characterized by KIC, were significantly increased as the PES content increased.

Original language	English
Title of host publication	Science and Technology of Hybrid Materials
Editors	Cheng-Jun Sun, Gan-Moog Chow, Jun Ding, Manoj Gupta, Lynn Kurihara, Lawrence Kabacoff
Publisher	Trans Tech Publications Ltd
Pages	159-162
Number of pages	4
ISBN (Print)	9783908451181
DOIs	https://doi.org/10.4028/www.scientific.net/SSP.111.159
Publication status	Published - 2006
Event	Symposium S Science and Technology of Hybrid Materials, 2005: 3rd International Conference on Materials for Advanced Technologies, ICMAT 2005 and International Union of Materials Research Societies-9th International Conference on Advanced Materials, IUMRS-ICAM 2005 - Singapore, Singapore Duration: 3 Jul 2005 → 8 Jul 2005

Publication series

Name	Solid State Phenomena
Volume	111
ISSN (Print)	1012-0394
ISSN (Electronic)	1662-9779

Conference

Conference	Symposium S Science and Technology of Hybrid Materials, 2005: 3rd International Conference on Materials for Advanced Technologies, ICMAT 2005 and International Union of Materials Research Societies-9th International Conference on Advanced Materials, IUMRS-ICAM 2005
Country/Territory	Singapore
City	Singapore
Period	3/07/05 → 8/07/05

Bibliographical note

Publisher Copyright:
© (2006) Trans Tech Publications, Switzerland.

Keywords

Epoxy resin
Mechanical properties
PES
Thermal stabilities

Access to Document

10.4028/www.scientific.net/SSP.111.159

Cite this

Park, S. J., Li, K., & Hong, S. K. (2006). Thermal stabilities and mechanical interfacial properties of polyethresulfone-modified epoxy resin. In C.-J. Sun, G.-M. Chow, J. Ding, M. Gupta, L. Kurihara, & L. Kabacoff (Eds.), Science and Technology of Hybrid Materials (pp. 159-162). (Solid State Phenomena; Vol. 111). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/SSP.111.159

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title = "Thermal stabilities and mechanical interfacial properties of polyethresulfone-modified epoxy resin",

abstract = "The thermal stabilities and mechanical interfacial properties of a diglycidyl ether of bisphenol-A (DGEBA) epoxy resin modified with different contents of polyethersulfone (PES) have been investigated. As a result, the curing reaction rate of DGEBA/PES blends was decreased with increasing the PES content. The blends exhibited slight decrease of thermal stabilities compared to the neat DGEBA. The mechanical interfacial properties, characterized by KIC, were significantly increased as the PES content increased.",

keywords = "Epoxy resin, Mechanical properties, PES, Thermal stabilities",

author = "Park, \{S. J.\} and K. Li and Hong, \{S. K.\}",

note = "Publisher Copyright: {\textcopyright} (2006) Trans Tech Publications, Switzerland.; Symposium S Science and Technology of Hybrid Materials, 2005: 3rd International Conference on Materials for Advanced Technologies, ICMAT 2005 and International Union of Materials Research Societies-9th International Conference on Advanced Materials, IUMRS-ICAM 2005 ; Conference date: 03-07-2005 Through 08-07-2005",

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doi = "10.4028/www.scientific.net/SSP.111.159",

language = "English",

isbn = "9783908451181",

series = "Solid State Phenomena",

publisher = "Trans Tech Publications Ltd",

pages = "159--162",

editor = "Cheng-Jun Sun and Gan-Moog Chow and Jun Ding and Manoj Gupta and Lynn Kurihara and Lawrence Kabacoff",

booktitle = "Science and Technology of Hybrid Materials",

}

Park, SJ, Li, K & Hong, SK 2006, Thermal stabilities and mechanical interfacial properties of polyethresulfone-modified epoxy resin. in C-J Sun, G-M Chow, J Ding, M Gupta, L Kurihara & L Kabacoff (eds), Science and Technology of Hybrid Materials. Solid State Phenomena, vol. 111, Trans Tech Publications Ltd, pp. 159-162, Symposium S Science and Technology of Hybrid Materials, 2005: 3rd International Conference on Materials for Advanced Technologies, ICMAT 2005 and International Union of Materials Research Societies-9th International Conference on Advanced Materials, IUMRS-ICAM 2005, Singapore, Singapore, 3/07/05. https://doi.org/10.4028/www.scientific.net/SSP.111.159

Thermal stabilities and mechanical interfacial properties of polyethresulfone-modified epoxy resin. / Park, S. J.; Li, K.; Hong, S. K.
Science and Technology of Hybrid Materials. ed. / Cheng-Jun Sun; Gan-Moog Chow; Jun Ding; Manoj Gupta; Lynn Kurihara; Lawrence Kabacoff. Trans Tech Publications Ltd, 2006. p. 159-162 (Solid State Phenomena; Vol. 111).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Thermal stabilities and mechanical interfacial properties of polyethresulfone-modified epoxy resin

AU - Park, S. J.

AU - Li, K.

AU - Hong, S. K.

N1 - Publisher Copyright: © (2006) Trans Tech Publications, Switzerland.

PY - 2006

Y1 - 2006

N2 - The thermal stabilities and mechanical interfacial properties of a diglycidyl ether of bisphenol-A (DGEBA) epoxy resin modified with different contents of polyethersulfone (PES) have been investigated. As a result, the curing reaction rate of DGEBA/PES blends was decreased with increasing the PES content. The blends exhibited slight decrease of thermal stabilities compared to the neat DGEBA. The mechanical interfacial properties, characterized by KIC, were significantly increased as the PES content increased.

AB - The thermal stabilities and mechanical interfacial properties of a diglycidyl ether of bisphenol-A (DGEBA) epoxy resin modified with different contents of polyethersulfone (PES) have been investigated. As a result, the curing reaction rate of DGEBA/PES blends was decreased with increasing the PES content. The blends exhibited slight decrease of thermal stabilities compared to the neat DGEBA. The mechanical interfacial properties, characterized by KIC, were significantly increased as the PES content increased.

KW - Epoxy resin

KW - Mechanical properties

KW - PES

KW - Thermal stabilities

UR - https://www.scopus.com/pages/publications/84955099093

U2 - 10.4028/www.scientific.net/SSP.111.159

DO - 10.4028/www.scientific.net/SSP.111.159

M3 - Conference contribution

AN - SCOPUS:84955099093

SN - 9783908451181

T3 - Solid State Phenomena

SP - 159

EP - 162

BT - Science and Technology of Hybrid Materials

A2 - Sun, Cheng-Jun

A2 - Chow, Gan-Moog

A2 - Ding, Jun

A2 - Gupta, Manoj

A2 - Kurihara, Lynn

A2 - Kabacoff, Lawrence

PB - Trans Tech Publications Ltd

T2 - Symposium S Science and Technology of Hybrid Materials, 2005: 3rd International Conference on Materials for Advanced Technologies, ICMAT 2005 and International Union of Materials Research Societies-9th International Conference on Advanced Materials, IUMRS-ICAM 2005

Y2 - 3 July 2005 through 8 July 2005

ER -

Thermal stabilities and mechanical interfacial properties of polyethresulfone-modified epoxy resin

Abstract

Publication series

Conference

Bibliographical note

Keywords

Access to Document

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